Programme

DAY 1

INKJET CHEMISTRY OVERVIEW
Primers and inks | Metal-specific chemistry

INKJET PHYSICS OVERVIEW
Printhead landscape (piezo, thermal and others) | Ink channel design | Fluid dynamics | Waveform generation and meniscus behaviour | Drop formation | Grayscale formation | Data path and printhead electronics 

FLUID DELIVERY
Ink supply landscape | Meniscus and pressure control | Recirculation vs. gravity

TECHNOLOGY ECOSYSTEM
Hardware, process, integration | Metal printing machine overview | Machine design and modularity | Market segments 

DAY 2

PRE-TREATMENT
Surface behaviour, energy and tension | One-time vs. multiple treatment | Flame and silane treatment | Influence of primers and additives | Ink adhesion strength and ink detachment | Hydrophobic vs. hydrophilic | Plasma treatment

PRINTHEADS, INK CHARACTERISATION AND FUNCTIONALITY 
Manufacturer overview | Object geometry (linear vs. helical jetting) | High resolution vs. high laydown | Waveforms | UV and water-based and solvent inks | The White Ink Dilemma | Ink composition and density | Surfactants, PIs and cosolvents | Temperature sensitivity | Safety and sustainability | Degassing and filtration 

DROP WATCHING
Drop placement | Strategies for missing nozzles and image stitching | Grayscale generation vs. binary printing modes | Drop formation and waveform

DAY 3

INK FORMULATION
UV and water-based ink formulation | Components and additives | Pigments (organic, inorganic) and dyes

CURING AND DRYING
IR and nIR | UV and UV LED | Curing issues by reflection around the object or in machine | Dosage and output | Wavelength influences

IMAGE QUALITY AND COLOUR MANAGEMENT
RIP overview | Colour gamut (CMYK vs. EG printing) | Spectrophotometers and light reflection on metal | Traditional vs. spherical light sources | Printer linearisation and profiling | Ink saving strategies | Ink-surface dependencies and artefacts 

DAY 4

PATENTS AND INNOVATIONS, MARKET AND TRENDS OUTLOOK
Selected patents and innovations from inkjet printing on metal | Haptic lacquers and layering techniques | Helix vs. segmented print | 3D object printing software | Mergers and acquisitions | Supplier ecosystem

PERSPECTIVES OF THE METAL PRINTING INDUSTRY
Guest presentation by Koenig & Bauer Metalprint: The presentation will explore single-pass and multi-pass metal printing approaches, highlighting the process requirements of both upstream and downstream operations, as well as the printing itself within the metal packaging market. The focus will be on the challenges of integrating digital printing into existing production lines and processes.

METAL PACKAGING TODAY AND TOMORROW: FOCUS ON SUSTAINABILITY
Guest presentation by Metal Packaging Europe: Metal packaging is under the spotlight as sustainability becomes a central focus across industries. This session explores the key trends and policies shaping both the present and future of metal packaging – from industry drivers and evolving European regulations to consumer preferences and recycling practices. It examines the expanding role of metal packaging in a context where sustainability and recyclability are at the forefront, offering a broad industry perspective on how these forces are influencing design, innovation, and manufacturing.

PROBLEM SOLVING, OPEN DISCUSSION
Pre-treatment | Ink wetting, adhesion and robustness | Filling lines | Filled goods | Lip contact lines | Stitching and pinning | Printhead motion control Printing irregular shapes | Printhead motion control